JANI, Parth. AI-Powered Eligibility Reconciliation for Dual Eligible Members Using AWS Glue. American Journal of Data Science and Artificial Intelligence Innovations, Newark, USA, v. 1, p. 578–594, 2021. Disponível em: https://ajdsai.org/index.php/publication/article/view/66.. Acesso em: 7 mar. 2026.